S453-S70-AAV1

Storage Server - 5th/4th Gen Intel^® Xeon^® Scalable - 4U DP 36+2-Bay SATA/SAS

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Dual 5th/4th Gen Intel^® Xeon^® Scalable Processors
8-Channel DDR5 RDIMM, 16 x DIMMs
2 x 10Gb/s LAN ports via Intel^® X710-AT2
2 x 1Gb/s LAN ports via Intel^® I210-AT
24 x 3.5"/2.5" SATA/SAS hot-swappable bays on the front side
12 x 3.5"/2.5" SATA/SAS hot-swappable bays on the rear side
2 x 2.5" SATA/SAS bays on rear side for boot drives
SAS expander with 12Gb/s transfer speed
2 x M.2 slots with PCIe Gen4 x4 interface
6 x LP PCIe Gen5 x16 slots
Dual 1600W 80 PLUS Titanium redundant power supply

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* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

4U
482.6 x 177 x 625

Motherboard

MS73-HB0

CPU

5th Generation Intel^® Xeon^® Scalable Processors
4th Generation Intel^® Xeon^® Scalable Processors
Dual processor, TDP up to 270W

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

2 x LGA 4677
Socket E

Chipset

Intel^® C741

Memory

16 x DIMM slots
DDR5 memory supported only
8-Channel memory architecture
RDIMM up to 96GB supported*

5th Gen Intel^® Xeon^®: Up to 5600 MT/s
4th Gen Intel^® Xeon^®: Up to 4800 MT/s

*Total memory supports up to 512GB with 1600W power supply. Please select 2000W power supply for higher memory configuration.

LAN

Rear side:
2 x 10Gb/s LAN ports (1 x Intel^® X710-AT2)
2 x 1Gb/s LAN ports (2 x Intel^® I210-AT)
Support NCSI function (by switch setting)

1 x 10/100/1000 Mbps Management LAN

Video

Integrated in Aspeed^® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp

Storage

Front side:
24 x 3.5"/2.5" SATA/SAS hot-swappable bays, connected to expander

Rear side:
12 x 3.5"/2.5" SATA/SAS hot-swappable bays, connected to expander
2 x 2.5" SATA/SAS bays for boot drives, from onboard connector
- (Additional SAS card is required for SAS support on boot drives)

1 x Broadcom SAS35x48 expanders
Bandwidth: SATA 6Gb/s or SAS 12Gb/s per port

SAS card is required to enable the drive bays

Recommended SAS cards:
CSA4710
CRA4760
CRA4761

SAS

Supported

RAID

Depends on SAS add-in cards

Expansion Slots

6 x PCIe x16 (Gen5 x16) low-profile slots

2 x M.2 slots:
- M-key
- PCIe Gen4 x4, from CPU_0
- Support 2280/22100 cards

Internal I/O

1 x TPM header
1 x VROC connector

Front I/O

2 x USB 3.2 Gen1
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x Storage activity LED
1 x System status LED

Rear I/O

2 x USB 3.2 Gen1
1 x VGA
1 x COM
4 x RJ45
1 x MLAN
1 x ID button with LED

Backplane Board

Speed and bandwidth:
Front side - CBPD4O0: SATA 6Gb/s or SAS 12Gb/s
Rear side - CBP2021: SATA 6Gb/s or SAS 12Gb/s
Rear side - CBPD0C0: SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

Dual 1600W 80 PLUS Titanium redundant power supply

AC Input:
- 100-127V~/ 12A, 50-60Hz
- 200-240V~/ 10A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 8A

DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 82A
+12.2Vsb/ 3A
- Max 1600W/ 200-240V~ or 240Vdc Input
+12.2V/ 132A
+12.2Vsb/ 3A

System Management

Aspeed^® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

4 x 80x80x38mm (16,300rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Packaging Dimensions

843 x 610 x 290 mm

Packaging Content

1 x S453-S70-AAV1
2 x CPU heatsinks
6 x Carriers
1 x 3-Section Rail kit

Part Numbers

- Barebone package (5th/4th Gen): 6NS453S70MR000ABV1*
- Barebone package (4th Gen): 6NS453S70MR000AAV1*
- Motherboard: 9MS73HB0NR-000
- 3-Section Rail kit: 25HB2-3A6104-I0R
- CPU heatsink: 25ST1-323208-A0R
- Backplane board - CBP2021: 9CBP2021NR-00
- Backplane board - CBPD0C0: 9CBPD0C0NR-00
- Backplane board - CBPD4O0: 9CBPD4O0NR-00
- Fan module: 25ST2-883829-D0R
- 1600W power supply: 25EP0-21600D-G1S

Optional parts:

- 2000W power supply (GosPower): 25EP0-22000L-G1S
- 2000W power supply (LITEON): 25EP0-22000M-L0S

* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SUPPORT

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版本

檔案大小

日期

Intel^® Chipset Driver

Version : 10.1.19485.8386

3.81 MB

Jan 04, 2024

S453-S70-AAV1

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S453-S70-AAV1