R272-P33

Rack Arm Server - Ampere® Altra® Max - 2U UP 8-Bay Gen3 NVMe
  • Hardware-level root of trust support
  • Single Ampere® Altra® Max / Altra® Processors
  • 8-Channel DDR4 RDIMM/LRDIMM, 16 x DIMMs
  • 2 x 1Gb/s LAN ports via Intel® I350-AM2
  • 8 x 2.5" Gen3 NVMe hot-swap bays
  • 2 x M.2 slots with PCIe Gen4 x4 interface
  • 4 x LP PCIe Gen4 x16 and x8 slots
  • 1 x OCP 2.0 mezzanine slot
  • 1+1 1300W 80 PLUS Platinum redundant power supplies
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[#1] 本網站所提供之產品規格、圖片及其他資訊僅供參考,如有差異應以實際產品為準。技嘉科技保留隨時修改內容的權利,並不對因使用上述資料而導致的任何損失承擔責任。
[#2] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值,實際效能可能因系統配置及使用環境而有所不同。
[#3] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。

SPECIFICATIONS

Dimensions (WxHxD, mm)
2U
438 x 87.5 x 660
Motherboard
MP32-AR1
CPU
Ampere® Altra® Processors
Ampere® Altra® Max Processors

Single processor, TDP 250W
Socket
1 x LGA 4926
Chipset
System on Chip
Memory
16 x DIMM slots
DDR4 memory supported
8-Channel memory per processor
RDIMM/LRDIMM: Up to 3200 MT/s

[Note] Only supports configurations with 1, 2, 4, 6, 8, 12, or 16 DIMMs.
LAN
Rear:
2 x 1Gb/s LAN (1 x Intel® I350-AM2)
1 x 10/100/1000 Mbps Management LAN
Video
Integrated in Aspeed® AST2500
- 1 x VGA port
Storage
Front hot-swap:
8 x 2.5" Gen3 NVMe

Internal M.2:
2 x M.2 (2242/2260/2280/22110), PCIe Gen4 x4
SAS
N/A
RAID
N/A
PCIe Expansion Slots
Slot_7: Disabled
Slot_6: LP x16 (Gen4 x16)
Slot_5: LP x16 (Gen4 x8)
Slot_4: LP x16 (Gen4 x16)
Slot_3: LP x16 (Gen4 x8)
Slot_2: LP x8 (Gen4 x8), occupied by CNV3122
Slot_1: LP x16 (Gen4 x8), occupied by CNV3122

1 x OCP 2.0 mezzanine (Gen3 x16)
Front I/O
2 x USB 3.0 ports (Type-A)
1 x Power button with LED
1 x ID button with LED
1 x Reset button
2 x LAN activity LEDs
1 x Storage activity LED
1 x System status LED
Rear I/O
3 x USB 3.0 ports (Type-A)
1 x VGA ports
1 x Debug port
2 x RJ45 ports
1 x MLAN port
1 x ID button with LED
Backplane Board
Speed and bandwidth:
PCIe Gen3 x4 or SATA 6Gb/s
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
Power Supply[#1]
1+1 1300W 80 PLUS Platinum redundant power supplies (-100)

AC Input:
- 100-127V~/ 12A, 47-63Hz
- 200-240V~/ 8A, 47-63Hz

DC Input:
- 240Vdc/ 8A

DC Output:
- Max 1000W/ 100-127V~
+12V/ 83A
+12Vsb/ 3A
- Max 1300W/ 200-240V~
+12V/ 108A
+12Vsb/ 3A

1+1 1300W 80 PLUS Titanium redundant power supplies (-1T0)

AC Input:
- 100-127V~/ 12A, 50-60Hz
- 200-240V~/ 8A, 50-60Hz

DC Input:
- 240Vdc/ 7A

DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 82A
+12Vsb/ 3A
- Max 1300W/ 200-240V~
+12.2V/ 106A
+12Vsb/ 3A
System Management
Aspeed® AST2500 Baseboard Management Controller
GIGABYTE Management Console web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Red Hat Enterprise Linux 8.3 or later
Red Hat Enterprise Linux 8.5 or later

CentOS 8.3-2011 or later
CentOS-8.4.2105 or later
CentOS-8.5.2111 or later

SUSE Linux Enterprise Server 15 SP2 or later
SUSE Linux Enterprise Server 15 SP3 or later

Ubuntu 18.04.5 LTS or later
Ubuntu 20.04.1 LTS or later
Ubuntu 22.04 LTS or later

Fedora Server 33-1.2 or later
Fedora Server 35-1.2 or later

OracleLinux R8 U2
OracleLinux R8 U5

Debian 10.9 (Buster)
Debian 11.1
System Fans
4 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
982 x 588 x 268 mm
Packaging Content
1 x R272-P33
1 x CPU heatsink
1 x 2-Section Rail kit
Part Numbers
- Barebone package: 6NR272P33MR-00-1*
- Motherboard: 9MP32AR1NR-00*
- 2-Section Rail kit (CMA not supported): 25HB2-3A0202-K0R
- CPU heatsink: 25ST1-353109-T1R
- Front panel board - CFP2001: 9CFP2001NR-00*
- Backplane board - CBP20O5: 9CBP20O5NR-00*
- Fan module: 25ST2-883829-D0R
- PCIe to NVMe HBA - CNV3122: 9CNV3122NR-00*
- Power supply (-100): 25EP0-213003-D0S / 25EP0-213002-F3S
- Power supply (-1T0): 25EP0-213005-G1S / 25EP0-21300C-G1S

Optional parts:

- 3-Section Rail kit (Supports CMA): 25HB2-AA6105-K0R
- Cable Management Arm: 25HB1-R18300-K0R
[#1] 伺服器產品未附帶電源線。客戶需自行選擇適當的電源線 (可選配件),或聯繫業務協助客製化。
[#2] 本網站所提供之產品規格、圖片及其他資訊僅供參考,如有差異應以實際產品為準。技嘉科技保留隨時修改內容的權利,並不對因使用上述資料而導致的任何損失承擔責任。
[#3] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值,實際效能可能因系統配置及使用環境而有所不同。
[#4] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。

SUPPORT

Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.

什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Windows Server 2016 R2 64bit
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Windows Server 2012 64bit
  • Windows 10 64bit
  • Ubuntu
  • Linux CentOS
  • Linux
工具程式
說明
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日期
GSM CLI
Version : 1.1.3
37.29 MB
Apr 18, 2025
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
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