R183-SF2-IAL1
- Immersion Cooling Server
- Supports up to 4 x Dual slot Gen5 GPUs
- Dual 5th/4th Gen Intel® Xeon® Scalable Processors
- Dual Intel® Xeon® CPU Max Series
- 8-Channel DDR5 RDIMM, 32 x DIMMs
- Dual ROM Architecture
- 2 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swap bays
- 4 x FHFL PCIe Gen5 x16 slots for GPUs
- 1 x FHFL PCIe Gen5 x16 slot
- 1 x FHHL PCIe Gen5 x16 slot
- 1 x Internal LP PCIe Gen4 x8 slot
- 1 x OCP NIC 3.0 PCIe Gen5 x16 slot
- Dual 2700W 80 PLUS Titanium redundant power supply
[#2] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值,實際效能可能因系統配置及使用環境而有所不同。
[#3] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。
SPECIFICATIONS
448 x 43.5 x 900
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Dual processor, TDP up to 350W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket E
DDR5 memory supported
8-Channel memory per processor
5th Gen Intel® Xeon®:
RDIMM: Up to 5600 MT/s (1DPC), 4400 MT/s (2DPC)
4th Gen Intel® Xeon®:
RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
Intel® Xeon® Max Series:
RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
1 x 10/100/1000 Mbps Management LAN
- 1 x Mini-DP
2 x 2.5" Gen5 NVMe/SATA/SAS-4 [1]
- (NVMe from CPU_0)
[1] SAS card is required to support SAS devices.
Onboard VROC key header
Support optional RAID add-in cards
- 1 x FHFL x16 (Gen5 x16), from CPU_0, for GPUs
- 2 x FHFL x16 (Gen5 x16), from CPU_1, for GPUs
- 1 x Internal LP x16 (Gen4 x8), from CPU_0
Riser Card CRC1240:
- 1 x FHHL x16 (Gen5 x16), from CPU_1
Riser Card CRS102B:
- 1 x FHFL x16 (Gen5 x16), from CPU_0, for GPUs
- 1 x FHFL x16 (Gen5 x16), from CPU_0 [1]
1 x OCP NIC 3.0 (Gen5 x16), from CPU_0
- Supports NCSI function
[1] Blocked when a Dual slot GPU is installed.
1 x Mini-DP
1 x MLAN port
1 x ID LED
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
- Optional TPM2.0 kit: CTM010
AC Input:
- 100-127V~/ 12A, 50-60Hz
- 200-240V~/ 16A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1008W/ 100-127V~
+12V/ 84A
+12Vsb/ 3A
- Max 2700W/ 200-240V~ or 240Vdc Input
+12V/ 225A
+12Vsb/ 3A
[1] The system power supply requires C19 power cord.
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
Additional certifications:
Windows Server 2025
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
2 x CPU heatsinks
1 x Mini-DP to D-Sub cable
2 x GPU power cables (12VHPWR, 400mm)
1 x GPU power cable (12VHPWR, 500mm)
1 x GPU power cable (12VHPWR, 650mm)
6 x Carriers
- Motherboard: 9MSF3GP0UR-000*
- CPU heatsink: 25ST1-4534Z0-S7R
- Backplane board - CBP2025: 9CBP2025NR-00*
- Riser card - CRC1240: 9CRC1240NR-00*
- Riser card - CRS102B: 9CRS102BNR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- GPU power cable (12VHPWR, 400mm): 25CRI-4003B1-Y4R
- GPU power cable (12VHPWR, 400mm): 25CRI-4003B2-Y4R
- GPU power cable (12VHPWR, 500mm): 25CRI-5003B1-Y4R
- GPU power cable (12VHPWR, 650mm): 25CRI-6503B0-Y4R
- Power supply: 25EP0-227001-D0S
[#2] 本網站所提供之產品規格、圖片及其他資訊僅供參考,如有差異應以實際產品為準。技嘉科技保留隨時修改內容的權利,並不對因使用上述資料而導致的任何損失承擔責任。
[#3] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值,實際效能可能因系統配置及使用環境而有所不同。
[#4] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。
SUPPORT
- All
- All
- Windows Server 2022
- Windows Server 2019
- Linux
Intel® SATA RAID and Utility
1. Updates RC 114.D30 (EagleStream IPU 2025.2 BKC WW10_2025).
2. Updates EMR Microcode:
EMR Production A* / R* Step: m_87_c06f2_210002a7.pdb;
3. Updates SPR Microcode:
SPR Production E* / S* Step: m_87_806f8_2b000639.pdb;
SPR HBM Production B* Step: m_10_806f8_2c0003f7.pdb;
4. Updates SPS to SPS_E5_06.01.04.089.0.
5. Updates RSTe/VROC UEFI driver to v9.0.0.2018.
6. Updates TDX Seamloader to TDX-SEAMLDR_1.5.02.00.
7. Updates TDX Module to TDX_1.5.13.00.864.
8. Security updates:
CVE-2025-20054, CVE-2025-20103,
CVE-2025-20044, CVE-2024-45332,
CVE-2025-20109, CVE-2024-42446,
CVE-2024-38796, CVE-2023-6237,
CVE-2024-5535, CVE-2024-6119.
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
RESOURCES
