H274-S61- AAW1

High Density Server - Intel® Xeon® 6 Processors - 2U 4-Node DP 8-Bay Gen5 NVMe/SATA/SAS-4 (350W CPU)
  • 2U 4-node rear access server system
  • Dual Intel® Xeon® 6 Processors per node, LGA 4710
  • 8-Channel DDR5 RDIMM / MCR DIMM, 16 x DIMMs per node
  • Dual ROM Architecture
  • 8 x 1Gb/s LAN ports via Intel® I350-AM2
  • 8 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swap bays
  • 4 x M.2 slots with PCIe Gen4 x4 interface (optional)
  • 4 x LP PCIe Gen5 x16 slots
  • 4 x OCP NIC 3.0 PCIe Gen5 x16 slots
  • Dual 3000W 80 PLUS Titanium redundant power supply
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* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 877
Motherboard
MS64-HD0
CPU
Intel® Xeon® 6 Processors
- Intel® Xeon® 6700E-Series Processors
- Intel® Xeon® 6700P-Series Processors (available Q1'25)
- Intel® Xeon® 6500P-Series Processors (available Q1'25)

Dual processor per node, TDP up to 270W
- No OCP cards at 35°C ambient, TDP up to 350W
- With OCP cards at 30°C ambient, TDP up to 350W

[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
8 x LGA 4710
Socket E2
Chipset
System on Chip
Memory
64 x DIMM slots
DDR5 memory supported
8-Channel memory architecture
MCR DIMM supported [1]
RDIMM: Up to 6400 MT/s
MCR DIMM: Up to 8000 MT/s

[1] MCR DIMMs are only supported with Intel® Xeon® 6 Processors with P-cores.
LAN
Rear (I/O board - CLBH160 x 4):
8 x 1Gb/s LAN (4 x Intel® I350-AM2)
- Support NCSI function

4 x 10/100/1000 Mbps Management LAN [1]

[1] Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.
Video
Integrated in Aspeed® AST2600 x 4
- 4 x Mini-DP
Storage
Front hot-swap:
8 x 2.5" Gen5 NVMe/SATA/SAS-4 [1]
- (NVMe & SATA from CPU_1)

Optional internal M.2 (CMTP160 x 4):
4 x M.2 (2260/2280/22110), PCIe Gen4 x4, from CPU_1

[1] SAS card is required to support SAS drives.
SAS
Require SAS add-in cards
RAID
Require RAID add-in cards
Onboard VROC key headers
PCIe Expansion Slots
Riser Card CRSH01R x 4:
- 4 x LP x16 (Gen5 x16), from CPU_0

4 x OCP NIC 3.0 (Gen5 x16), from CPU_0
- Support NCSI function
Front I/O
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button
Rear I/O
I/O board - CLBH160 x 4:
8 x USB 3.2 Gen1 ports (Type-A)
4 x Mini-DP
8 x RJ45 ports
4 x MLAN ports
4 x System status LEDs
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
Security Modules
4 x TPM headers with SPI interface
- Optional TPM2.0 kit: CTM012

4 x PRoT connectors (only enabled on RoT SKU)
Power Supply
Dual 3000W 80 PLUS Titanium redundant power supply [1]

AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 16A

DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A

[1] The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 Baseboard Management Controller
Aspeed® AST2620 Chassis Management Controller
GIGABYTE Management Console web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
4 x 80x80x80mm (16,500rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
1179 x 700 x 380 mm
Packaging Content
1 x H274-S61-AAW1
8 x CPU heatsinks
1 x Mini-DP to D-Sub cable
16 x Carriers
1 x 3-Section Rail kit
Part Numbers
- Barebone package: 6NH274S61DR000AAW1*
- Motherboard: 9MS64HD0UR-000*
- 3-Section Rail kit: 25HB2-A66125-K0R
- CPU heatsink: 25ST1-253108-C1R/25ST1-253110-C1R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH081: 9CBPH081NR-00*
- Fan module: 25ST2-888020-S1R
- Riser card - CRSH01R: 9CRSH01RNR-00*
- I/O board - CLBH160: 9CLBH160NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000V-L0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 riser card - CMTP160: 9CMTP160NR-00*
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。

SUPPORT

Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.

什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。

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GSM CLI
Version : 2.1.77
147.89 MB
Sep 27, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
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