H274-A81-LAZ1

High Density Server - Intel^® Xeon^® 6 Processors - 2U 4-Node DP 8-Bay Gen5 NVMe/SATA/SAS-4 DLC

# 高效能運算伺服器 # 超融合伺服器 # 私有雲/混和雲伺服器

Direct liquid cooling solution with leak detection
2U 4-node rear access server system
Dual Intel^® Xeon^® 6 Processors per node, LGA 7529
12-Channel DDR5 RDIMM / MRDIMM, 24 x DIMMs per node
Dual ROM Architecture
8 x 1Gb/s LAN ports via Intel^® I350-AM2
8 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swap bays
4 x LP PCIe Gen5 x16 slots
4 x LP PCIe Gen5 x16 slots (optional)
2 x 3600W 80 PLUS Titanium redundant power supplies

Ordering Numbers:
With cold plates: 6NH274A81DR000LAZ1*
Without cold plates: 6NH274A81DZ000LAZ1*

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* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4-Node - Rear access
447 x 86.8 x 895

Motherboard

MA84-HD0

CPU

Intel^® Xeon^® 6 Processors
- Intel^® Xeon^® 6900-Series Processors

Dual processor per node, TDP up to 500W

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

8 x LGA 7529
Socket BR

Chipset

System on Chip

Memory

96 x DIMM slots
DDR5 memory supported
12-Channel memory per processor
MRDIMM supported^[1]
RDIMM: Up to 6400 MT/s
MRDIMM: Up to 8800 MT/s

^[1]MRDIMMs are only supported with Intel^® Xeon^® 6 Processors with P-cores.

^[Note]When 96GB DIMMs are installed, the maximum ambient temperature is limited to 30℃.

LAN

Rear (I/O board - CLNP319 x 4):
8 x 1Gb/s LAN (4 x Intel^® I350-AM2)
- Support NCSI function

4 x 10/100/1000 Mbps Management LAN^[1]

^[1]Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.

Video

Integrated in ASPEED^® AST2600 x 4
- 4 x Mini-DP

Storage

Front hot-swap:
8 x 2.5" Gen5 NVMe/SATA/SAS-4^[1]
- (NVMe from CPU_1)

^[1]Storage card is required to support SATA and SAS drives.

SAS

Require SAS add-in cards

RAID

Require RAID add-in cards
Onboard VROC key header

PCIe Expansion Slots

Riser Card CRCH010 x 8:
- 4 x LP x16 (Gen5 x16), from CPU_0
- 4 x LP x16 (Gen5 x16), from CPU_0^[1]

^[1]Enabling the slots requires specific cold plate loops and tubes relocation. Please contact our sales representatives if the feature is needed.

^[Note]When NVIDIA BlueField^®-3 DPUs/SuperNICs or ConnectX^®-7 NICs are installed, the maximum ambient temperature is limited to 30℃.

Front I/O

4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button

Rear I/O

I/O board - CLNP319 x 4:
8 x USB 3.2 Gen1 ports (Type-A)
4 x Mini-DP
8 x RJ45 ports
4 x MLAN ports
4 x ID buttons with LED
4 x System status LEDs

Backplane Board

Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s

Security Modules

4 x TPM headers with SPI interface
- Optional TPM2.0 kit: CTM012

4 x PRoT connectors (only enabled on RoT SKU)

Power Supply

2 x 3600W 80 PLUS Titanium redundant power supplies^[1]

AC Input:
- 200-240V~/ 20A, 50/60Hz

DC Input:
- 240Vdc/ 20A

DC Output:
- Max 3120W/ 200-207V~
+12.2V/ 255.6A
+12.2Vsb/ 3A
- Max 3600W/ 208-240V~ or 240Vdc Input
+12.2V/ 295.1A
+12.2Vsb/ 3A

^[1]The system power supply requires C19 power cord.

System Management

ASPEED^® AST2600 Baseboard Management Controller
ASPEED^® AST2620 Chassis Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

4 x 80x80x38mm (18,300rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

^[Note]To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.

Packaging Dimensions

1190 x 711 x 423 mm

Packaging Content

1 x H274-A81-LAZ1
4 x CoolIT CPU cold plate loops
1 x Mini-DP to D-Sub cable
8 x Carriers
1 x L-shape Rail kit

Part Numbers

- Barebone w/ cold plates: 6NH274A81DR000LAZ1*
- Barebone w/o cold plates: 6NH274A81DZ000LAZ1*
- Motherboard: 9MA84HD0UR-000*
- L-shape Rail kit: 25HB2-A86104-K0R
- CoolIT CPU cold plate loop: 25ST7-10000F-C4R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH081: 9CBPH081NR-00*
- Fan module: 25ST2-88382P-S1R
- Riser card - CRCH010: 9CRCH010NR-00*
- I/O board - CLNP319: 9CLNP319NR-00*
- CoolIT leak sensor board - CDB81: 9CDB81NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-236003-L0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R

* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SUPPORT

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版本

檔案大小

日期

Intel^® Chipset Driver

Version : 10.1.19975.8620

6.41 MB

Oct 08, 2024

H274-A81-LAZ1

SPECIFICATIONS

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H274-A81-LAZ1