H263-V60- AAW1

2U 4-Node - Rear access
440 x 87.5 x 850

MV63-HD0

Per node:
NVIDIA Grace™ CPU Superchip:
- 2 x NVIDIA Grace™ CPUs
- Connected with NVIDIA^® NVLink^®-C2C
- TDP up to 500W (CPU + memory)

Per node:
480GB of LPDDR5X memory with ECC ^[1]
Memory bandwidth up to 1TB/s <sup>[1]

[1]</sup> Modules with 960GB of CPU memory and 768GB/s memory bandwidth are also available. Please contact our sales representatives for more details.

Rear:
4 x 10/100/1000 Mbps Management LAN
1 x CMC Management LAN

Integrated in ASPEED^® AST2600 x 4
- 4 x VGA ports

Front hot-swap:
16 x 2.5" Gen5 NVMe
- (8 x NVMe from CPU_0, 8 x NVMe from CPU_1)

Internal M.2:
8 x M.2 (2280/22110), PCIe Gen5 x4, from CPU_1

N/A

N/A

PCIe Cable x 8:
- 4 x LP x16 (Gen5 x16), from CPU_0
- 4 x LP x16 (Gen5 x16), from CPU_1

4 x OCP NIC 3.0 (Gen5 x16), from CPU_0
- Support NCSI function

4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button

8 x USB 3.2 Gen1 ports (Type-A)
4 x VGA ports
4 x MLAN ports
4 x ID buttons with LED
1 x CMC port

Speed and bandwidth:
PCIe Gen5 x4

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM012

2+1 3000W 80 PLUS Titanium redundant power supplies ^[1]

AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 16A

DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A

^[1] The system power supply requires C19 power cord.

ASPEED^® AST2600 Baseboard Management Controller
ASPEED^® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface

• Dashboard
• HTML5 KVM
• Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
• Sensor Reading History Data
• FRU Information
• SEL Log in Linear Storage / Circular Storage Policy
• Hardware Inventory
• Fan Profile
• System Firewall
• Power Consumption
• Power Control
• Advanced power capping
• LDAP / AD / RADIUS Support
• Backup & Restore Configuration
• Remote BIOS/BMC/CPLD Update
• Event Log Filter
• User Management
• Media Redirection Settings
• PAM Order Settings
• SSL Settings
• SMTP Settings

Please refer to OS compatibility table in support page

4 x 80x80x80mm (16,500rpm)

Operating temperature: 10°C to 30°C
Operating humidity: 10-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-90% (non-condensing)

1185 x 712 x 320 mm

1 x H263-V60-AAW1
8 x Superchip heatsinks
1 x 3-Section Rail kit

- Barebone w/ NVIDIA module: 6NH263V60MR000AAW1*
- Motherboard: 9MV63HD0UR-000*
- 3-Section Rail kit: 25HB2-A66125-K0R
- Superchip heatsink: 25ST1-2532Z1-A0R
- Superchip heatsink: 25ST1-2532Z4-A0R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH7O1: 9CBPH7O1NR-00*
- Fan module: 25ST2-888020-S1R
- M.2 riser card - CMTP0A2: 9CMTP0A2NR-00*
- LAN board - CLBH010: 9CLBH010NR-00*
- Power supply: 25EP0-23000L-L0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- RMA packaging: 6NH263V60SR-RMA-A100