H263-S63- LAN1

High Density Server - 5th/4th Gen Intel® Xeon® Scalable - 2U 4-Node DP 8-Bay Gen4 NVMe/SATA/SAS 2600W DLC
  • Direct liquid cooling solution
  • 2U 4-node rear access server system
  • Dual 5th/4th Gen Intel® Xeon® Scalable Processors per node
  • Dual Intel® Xeon® CPU Max Series per node
  • 8-Channel DDR5 RDIMM, 16 x DIMMs per node
  • Dual ROM Architecture
  • 1 x CMC port
  • 8 x 2.5" Gen4 NVMe/SATA/SAS hot-swap bays
  • 4 x M.2 slots with PCIe Gen4 x4 interface (optional)
  • 4 x LP PCIe Gen5 x16 slots
  • 4 x OCP NIC 3.0 PCIe Gen5 x16 slots
  • Dual 2600W 80 PLUS Titanium redundant power supply
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* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 840
Motherboard
MS63-HD1
CPU
5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series

Dual processor per node, TDP up to 385W

[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
8 x LGA 4677
Socket E
Chipset
Intel® C741
Memory
64 x DIMM slots
DDR5 memory supported
8-Channel memory architecture

5th Gen Intel® Xeon®:
RDIMM: Up to 5600 MT/s

4th Gen Intel® Xeon®:
RDIMM: Up to 4800 MT/s

Intel® Xeon® Max Series:
RDIMM: Up to 4800 MT/s
LAN
4 x 10/100/1000 Mbps Management LAN
1 x CMC Management LAN [1]

[1] Please refer to optional parts for ring topology support.

[Note] Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.
Video
Integrated in Aspeed® AST2600 x 4
- 4 x VGA ports
Storage
Front hot-swap:
8 x 2.5" Gen4 NVMe/SATA/SAS [1]
- (NVMe from CPU_1)

Optional internal M.2 (CMTP061 x 4):
4 x M.2 (2280/22110), PCIe Gen4 x4, from CPU_1

[1] SAS card is required to support SAS drives.
SAS
Require SAS add-in cards
RAID
Intel® SATA RAID 0/1
Onboard VROC key header

Support optional RAID add-in cards
PCIe Expansion Slots
Riser Card CRSH01U x 4:
- 4 x LP x16 (Gen5 x16), from CPU_0

4 x OCP NIC 3.0 (Gen5 x16), from CPU_0
- Support NCSI function
Front I/O
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button
Rear I/O
8 x USB 3.2 Gen1 ports (Type-A)
4 x VGA ports
4 x MLAN ports
4 x ID buttons with LED
1 x CMC port
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
Power Supply
Dual 2600W 80 PLUS Titanium redundant power supply [1]
Available for 2+1 redundant power supply configuration (optional)

AC Input:
- 100-127V~/ 15A, 50-60Hz
- 200-240V~/ 15A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 15A

DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 82A
+12.2Vsb/ 4.5A
- Max 2600W/ 200-240V~ or 240Vdc Input
+12.2V/ 213A
+12.2Vsb/ 4.5A

[1] The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 Baseboard Management Controller
Aspeed® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page

Additional certifications:
Windows Server 2022 (x64)
System Fans
4 x 80x80x38mm (18,300rpm)
Operating Properties
Operating temperature: 10°C to 40°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.
Weight
Net Weight: 44.6 kg
Gross Weight: 49.24 kg
Packaging Dimensions
w/ cold plate loops: 1185 x 705 x 409 mm
w/o cold plate loops: 1176 x 709 x 322 mm
Packaging Content
1 x H263-S63-LAN1
4 x CoolIT CPU cold plate loops
24 x Carriers
1 x 3-Section Rail kit
Part Numbers
- Barebone w/ cold plates (5th/4th Gen): 6NH263S63DR000LBN1*
- Barebone w/ cold plates (4th Gen): 6NH263S63DR000LAN1*
- Barebone w/o cold plates (5th/4th Gen): 6NH263S63DZ000LBN1*
- Barebone w/o cold plates (4th Gen): 6NH263S63DZ000LAN1*
- Motherboard: 9MS63HD1UR-000*
- 3-Section Rail kit: 25HB2-A66125-K0R
- CoolIT CPU cold plate loop: 25ST7-100006-C4R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH081: 9CBPH081NR-00*
- Fan module: 25ST2-88382P-S1R
- Riser card - CRSH01U: 9CRSH01UNR-00*
- Power supply: 25EP0-226001-G1S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 riser card - CMTP061: 9CMTP061NR-00*
- Ring topology kit (10-kit package): 6NH263S62S1000AAN11
- GIGABYTE CPU cold plate loop: 25H26-3S62000-E01X (QPA:4)
- GIGABYTE 2U4N Manifold: 25H27-3Z80000-E07X (1 set per rack)
- Motivair CPU cold plate loop: 25ST7-10000B-M4R (QPA:4)
- CoolIT leak sensor board: 6NH263S62S1000LAN11 (QPA:4)
- RMA packaging: 6NH263S63SR-RMA-L100
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。

SUPPORT

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Linux
RAID
Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.

什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Windows Server 2016 R2 64bit
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Windows Server 2012 64bit
  • Windows 10 64bit
  • VMware
  • Ubuntu
  • Linux CentOS
  • Linux
工具程式
說明
版本
檔案大小
日期
GSM CLI
Version : 2.1.77
147.89 MB
Sep 27, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
使用手冊
說明
版本
檔案大小
日期
說明
版本
檔案大小
日期
作業系統支援列表
Version : R12
0.22 MB
Jul 15, 2024
4th Generation Intel® Xeon® Scalable Processors
5th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series

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