Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 840
CPU
3rd Generation Intel® Xeon® Scalable Processors
Dual processor per node, 10nm technology
CPU TDP up to 270W
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
Per Node:
2 x LGA 4189
Total:
8 x LGA 4189
Socket P+
Chipset
Intel® C621A Chipset
Memory
Per node:
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
8-channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
1.2V modules: 3200/2933/2666 MT/s
LAN
Per node:
2 x 10Gb/s LAN ports (1 x Intel® X710-AT2)
Support NCSI function
1 x Dedicated management port
Total:
8 x 10Gb/s LAN ports (4 x Intel® X710-AT2)
Support NCSI function
4 x Dedicated management ports
1 x CMC port
Video
Integrated in Aspeed® AST2600 x 4
- 4 x VGA ports
Storage
Per node:
6 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_1
Total:
24 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_1
SAS card is required for SAS devices support
SAS
Depends on SAS add-in cards
RAID
Intel® SATA RAID 0/1/5/10
Expansion Slots
Per node:
Riser Card CRSH01D:
- 1 x PCIe x16 (Gen4 x16) low-profile slot
Riser Card CRSH01E:
- 1 x PCIe x16 (Gen4 x16) low-profile slot
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x8 bandwidth*
Total:
Riser Card CRSH01D x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots
Riser Card CRSH01E x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x8 bandwidth*
*OCP 2.0 bandwidth is shared with onboard LAN. Onboard LAN would be disabled if OCP 2.0 utilizes Gen3 x16 bandwidth.
Internal I/O
Per node:
1 x COM header
1 x SATA 7-pin connectors
1 x TPM header
1 x VROC connector
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button
Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
4 x Reset button
*1 x CMC Status LED
*1 x CMC Reset button
*Only one CMC Status LED and Reset button per system
Rear I/O
Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port
*Only one CMC port per system
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
-
Optional TPM2.0 kit:
CTM010
Power Supply
Dual 2200W 80 PLUS Platinum redundant power supply
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Input:
- 240Vdc/ 12.6A
DC Output:
- Max 1200W/ 100-127V~
+ 12.12V/ 95.6A
+ 12Vsb/ 3.5A
- Max 2200W/ 200-240V~
+ 12.12V/ 178.1A
+ 12Vsb/ 3.5A
Note: The system power supply requires C19 power cord.
System Management
Aspeed
® AST2600 Baseboard Management Controller
Aspeed
® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP/AD/RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Citrix Hypervisor 8.2.0 or later
Red Hat Enterprise Linux 7.9 or later
Red Hat Enterprise Linux 8.2 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 12 SP5 or later
SUSE Linux Enterprise Server 15 SP2 or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later
Windows Server 2016
Windows Server 2019
Windows Server 2022
System Fans
8 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 30°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Please leave one PCIe slot empty if using processor with 270W TDP
Weight
Net Weight: 26.2 kg
Gross Weight: 49.34 kg
Packaging Dimensions
1180 x 779 x 300 mm
Packaging Content
1 x H262-NO0
8 x CPU heatsinks
1 x 3-Section Rail kit
Part Numbers
- Barebone package: 6NH262NO0MR-00-1*
- Motherboard: 9MH62HD1NR-00
- 3-Section Rail kit: 25HB2-A66122-K0R
- CPU heatsink: 25ST1-453212-M1R/25ST1-453213-M1R
- Backplane board - CBPH7O0: 9CBPH7O0NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power Supply: 25EP0-222003-D0S
Optional parts:
- VROC module: 25FD0-R181N0-10R (Supported for Intel SSD only)
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 expansion card - CMTP16Z: 9CMTP16ZNR-00
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH262NO0SR-RMA-A100
