G363-ZR0- AAX1

Rev. 3.x Rev. 1.x

HPC/AI Server - AMD EPYC™ 9005/9004 - 3U DP HGX™ H100 4-GPU

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NVIDIA-Certified Systems™ - Data Center Servers
NVIDIA HGX™ H100 4-GPU
4th-generation NVIDIA^® NVLink^® 900GB/s
Dual AMD EPYC™ 9005/9004 Series Processors
12-Channel DDR5 RDIMM, 24 x DIMMs
Dual ROM Architecture
2 x 10Gb/s LAN ports via Broadcom^® BCM57416
2 x 1Gb/s LAN ports via Intel^® I350-AM2
4 x 2.5" Gen5 NVMe/SATA/SAS hot-swap bays
4 x 2.5" Gen5 NVMe hot-swap bays
1 x M.2 slot with PCIe Gen4 x4 interface
6 x LP PCIe Gen5 x16 slots
2+1 3000W 80 PLUS Titanium redundant power supplies

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* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

3U
448 x 130 x 800

Motherboard

MZ83-HD1

CPU

AMD EPYC™ 9005 Series Processors
AMD EPYC™ 9004 Series Processors

Dual processor, cTDP up to 400W^[1]

^[1]Please refer to the QVL on the support page or contact our sales representatives for verified CPU SKUs.

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

2 x LGA 6096
Socket SP5

Chipset

System on Chip

Memory

24 x DIMM slots
DDR5 memory supported
12-Channel memory architecture

AMD EPYC™ 9005:
RDIMM: Up to 6000 MT/s

AMD EPYC™ 9004:
RDIMM: Up to 4800 MT/s

LAN

Front (I/O board - CLBH160):
2 x 1Gb/s LAN (1 x Intel^® I350-AM2)
- Support NCSI function

1 x 10/100/1000 Mbps Management LAN

Rear:
2 x 10Gb/s LAN (1 x Broadcom^® BCM57416)
- Support NCSI function

Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN

^[Note]When both MLAN ports are connected with cables, the front MLAN port will be set as the default.

Video

Integrated in Aspeed^® AST2600
- 1 x Mini-DP

Storage

Front hot-swap:
4 x 2.5" Gen5 NVMe/SATA/SAS^[1]
4 x 2.5" Gen5 NVMe
- (4 x NVMe from CPU_0, 4 x NVMe from CPU_1)
- (SATA from CPU_0)

Internal M.2 (CMTP192):
1 x M.2 (2280/22110), PCIe Gen4 x4, from CPU_0

^[1]SAS card is required to support SAS drives.

SAS

Require SAS add-in cards

RAID

Require RAID add-in cards

Modular GPU

NVIDIA HGX™ H100 with 4 x SXM5 GPUs

PCIe Expansion Slots

Front:
1 x LP x16 (Gen5 x16), from CPU_0
1 x LP x16 (Gen5 x16), from CPU_1

1 x OCP NIC 3.0, from CPU_0, disabled

Rear:
4 x LP x16 (Gen5 x16), from PEX89144, support RDMA
- (Equipped with full-height brackets)

Front I/O

1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x Storage activity LED
1 x System status LED

I/O board - CLBH160:
2 x USB 3.2 Gen1 ports (Type-A)
1 x Mini-DP
2 x RJ45 ports (Intel I350)
1 x MLAN port (default)

Rear I/O

2 x RJ45 ports (Broadcom BCM57416)

MLAN board - CDB66:
1 x MLAN port

Backplane Board

Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS 12Gb/s

Security Modules

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

2+1 3000W 80 PLUS Titanium redundant power supplies^[1]

AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 14A

DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A

^[1]The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

7 x 80x80x80mm (17,000rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Packaging Dimensions

1176 x 782 x 295 mm

Packaging Content

1 x G363-ZR0-AAX1
2 x CPU heatsinks
1 x Mini-DP to D-Sub cable
1 x L-type Rail kit

Part Numbers

- Barebone w/ NVIDIA module: 6NG363ZR0DR000ACX1*
- Motherboard: 9MZ83HD1UR-000-3*
- L-type Rail kit: 25HB2-A86102-K0R
- CPU heatsink: 25ST1-15320H-A3R
- GPU heatsink: 25ST1-3332G0-F2R
- Front panel board - CFP1000: 9CFP1000NR-00*
- Backplane board - CBP2081: 9CBP2081NR-00*
- Fan module: 25ST2-808035-S1R
- Fan module: 25ST2-888030-S1R
- Fan module: 25ST2-888031-S1R
- M.2 expansion card - CMTP192: 9CMTP192NR-00*
- Riser card - CRSH01R: 9CRSH01RNR-00*
- OCP card - CNVC171: 9CNVC171NR-00*
- Front I/O board (incl. I350-AM2) - CLBH160: 9CLBH160NR-00*
- PCIe switch board - CPBG901: 9CPBG901NR-00*
- Rear MLAN board - CDB66: 9CDB66NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000J-D0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- RMA packaging: 6NG363ZR0SR-RMA-A100

* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SUPPORT

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BIOS

工具程式

Firmware

QVL

BIOS

說明

版本

檔案大小

日期

Updated support for AMD EPYC™ 9005 series processors.

Version : R01_F15

44.3 MB

Oct 24, 2024

G363-ZR0- AAX1 .svg-ArrowDownSolid-color { fill: #707070 }

SPECIFICATIONS

SUPPORT

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G363-ZR0-AAX1 (Rev. 3.x)

G363-ZR0- AAX1