SDM-1115G4L
Intel® Smart Display Module with Intel® 11th Generation Core™ i3-1115G4 Processor
(For more product information, please contact us at sales@gigaipc.com)
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11th Generation Intel® Core™ ProcessorsIntel's blazing fast, feature packed processor family with built-in security is ready to take your productivity, and creativity to the next level. And, by enabling new exciting Windows 10 features, the 11th generation Intel Core processors empower you to unleash your imagination and explore the possibilities.
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HDMI™-The Next Generation Multimedia InterfaceHDMI™ is a High-Definition Multimedia Interface which provides up to 5Gb/s video transmitting bandwidth and 8-channel high quality audio all through a single cable. Able to transmit superior, uncompressed digital video and audio, HDMI™ ensures the crispest rendering of digital content up to 1080p without the quality losses associated with analog interfaces and their digital-to-analog conversion. In addition, HDMI™ is compatible with HDCP (High-bandwidth Digital Content Protection), allowing the playback of Blu-ray/HD DVD and other protected media content.
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SuperSpeed USB 3.0With superfast transfer rates of up to 5 Gbps, users are able to experience a theoretical 10x improvement over USB 2.0. Additionally, backwards compatibility with USB 2.0 assures users of long term use of their legacy USB 2.0 devices.
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M.2 Onboard ConnectorProviding users PCI-Express connectivity for SSD devices. Delivering up to 10 Gbps data transfer speeds, M.2 offers users considerably faster storage performance than current mSATA and even SATA Revision 3 6Gbps storage devices.
[#1] 本網站所提供之產品規格、圖片及其他資訊僅供參考,如有差異應以實際產品為準。技嘉科技保留隨時修改內容的權利,並不對因使用上述資料而導致的任何損失承擔責任。
[#2] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值,實際效能可能因系統配置及使用環境而有所不同。
[#3] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。
[#2] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值,實際效能可能因系統配置及使用環境而有所不同。
[#3] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。
SPECIFICATIONS
Board Size
SDM-Large
175W x 100D(mm)
175W x 100D(mm)
Operating Properties
Operating temperature: 0°C to 55°C
Operating humidity: 0-90% (non-condensing)
Non-operating temperature: -40°C to 85°C
Non-operating humidity: 0%-95% (non-condensing)
Operating humidity: 0-90% (non-condensing)
Non-operating temperature: -40°C to 85°C
Non-operating humidity: 0%-95% (non-condensing)
Processor Supported
Intel® Core™ i3-1115G4 Processor
10nm SuperFin, 2 cores, 4 threads, up to 4.10 GHz
TDP 28W
10nm SuperFin, 2 cores, 4 threads, up to 4.10 GHz
TDP 28W
Socket
1 x FCBGA1449
Memory Type
2 x DDR4 SO-DIMM sockets, Max. Capacity 64 GB
Support Dual Channel DDR4 3200 MHz memory modules
Support Dual Channel DDR4 3200 MHz memory modules
Integrated Network
1 x GbE LAN Port (Intel® I219V)
Integrated Video Controller
Integrated Graphics Processor - Intel® UHD Graphics:
1 x HDMI 2.0 (SDM), supporting a maximum resolution of 4096x2160 @60Hz
1 x Display Port (SDM), supporting a maximum resolution of 4096x2160 @60Hz
2 x HDMI 2.0 (Rear), supporting a maximum resolution of 4096x2160 @60Hz
(4 independent display outputs)
1 x HDMI 2.0 (SDM), supporting a maximum resolution of 4096x2160 @60Hz
1 x Display Port (SDM), supporting a maximum resolution of 4096x2160 @60Hz
2 x HDMI 2.0 (Rear), supporting a maximum resolution of 4096x2160 @60Hz
(4 independent display outputs)
Integrated Audio Controller
Intel® Integrated Audio
Expansion Slot
1 x 2280 M.2 M-Key (PCIe x4, SATA 6Gb/s)
1 x 2230 M.2 E-Key
1 x 2230 M.2 E-Key
Rear I/O Connectors
2 x HDMI
1 x RJ45 LAN Port
3 x USB 3.2 Gen 1
1 x USB 2.0
1 x PWR LED
1 x HDD LED
2 x External Antenna Holes (Optional)
1 x Reset button
1 x Power button
1 x RJ45 LAN Port
3 x USB 3.2 Gen 1
1 x USB 2.0
1 x PWR LED
1 x HDD LED
2 x External Antenna Holes (Optional)
1 x Reset button
1 x Power button
TPM
1 x TPM header
OS Driver Supported
Windows® 10 (x64)
Packaging Bundle
Carton size: 465 x 351 x 217 (mm)
Packing Capacity: 10pcs
Including:
Screw Kit with #0 ZIPLOCK BAG SCREW-BIND M3.0*L5.0 NI x 2pcs (P/N: 25KSD-130053-S0R)
Packing Capacity: 10pcs
Including:
Screw Kit with #0 ZIPLOCK BAG SCREW-BIND M3.0*L5.0 NI x 2pcs (P/N: 25KSD-130053-S0R)
Ordering Information
9MTGU3ALMR-SI (Box packing)
[#1] 本網站所提供之產品規格、圖片及其他資訊僅供參考,如有差異應以實際產品為準。技嘉科技保留隨時修改內容的權利,並不對因使用上述資料而導致的任何損失承擔責任。
[#2] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值,實際效能可能因系統配置及使用環境而有所不同。
[#3] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。
[#2] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值,實際效能可能因系統配置及使用環境而有所不同。
[#3] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。
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