New AMD EPYC™ Family of Processors - Same Great SP5 Platform
The SP5 socket has reached its pinnacle form with 5th Generation AMD EPYC™ processors. The same successful platform that was shared by AMD EPYC™ 9004 & 8004 series processors is now the same one for AMD EPYC™ 9005 series processors. With up to 192 cores, increased frequencies and cache, this top tier performance platform targets general purpose, cloud native, and technical computing. Building on the advantages of the EPYC™ 9004 series, the new EPYC™ 9005 series adopts the 3nm process with AMD “Zen5” and “Zen5c” core architecture, excelling in both energy efficiency and cost optimization. GIGABYTE has already prepared for this new processor with new servers and updates to existing products for 4th Gen AMD EPYC™ processors.
5th Generation AMD EPYC™ Processors for SP5 Socket
3nmarchitecture
Increased transistor density alongside a reduction in power consumption
Up to 192CPU cores
Dedicated “Zen 5” & “Zen 5c” cores increase compute density
Up to 512MBL3 cache
An L3 cache increase helps to reduce latency in data-intensive operations
12channels
Memory capacity up to 9TB in a 2 DIMM per channel configuration
Up to 160PCIe lanes
Dual socket configuration adds a significant amount of I/O connectivity
CXL 2.0support
Disaggregated compute architecture possible via Compute Express Link
- AMD EPYC™ 9005 Series processors require OEM enablement and a BIOS update from your server or motherboard manufacturer if used with a motherboard designed for the SP5 socketed AMD EPYC™ 9004 Series processors. Contact your system manufacturer prior to purchase to determine compatibility.
- CXL Type 1&2 devices and PCIe link encryption support dependent upon ecosystem readiness; type 2 PoC only.
TO25-Z10-AA01 Block Diagram
GIGABYTE OCP ORV3 Compliant Solutions
GIGABTYE is an active member of the OCP, regularly attending the OCP's annual summits and continuously designing and releasing new compute, storage and GPU server hardware based on the OCP Open Rack Standard specifications and providing the best performing mezzanine cards for your OCP solution. GIGABYTE’s latest OCP server product line is based on OCP Open Rack V3 specification. The products are designed for a 21" OCP rack and feature a separate PSU system, with power supplied to each server node by a bus-bar system running along the rear of the rack.
Add-on Card
GPU Server
Compute Node
Node Tray
JBOD
OCP 21' RackGIGABYTE OCP ORV3 Compliant Solutions Advantages
Efficient Rack Density
- Optimal design (2OU 2nodes / 2OU 3nodes) - balanced consideration between density and power consumption.
Thermal Optimization
- Best thermal consideration to develop Rack and Nodes based on Cold Aisle/Hot Aisle concept.
- Reduce power consumption of cooling.
Greater Power Efficiency
- Low PUE helps reduce data center operating expense.
- Central power shelf design to enhance power efficiency and optimize power consumption.
Easy Maintenance
- Easier maintenance in front cold aisle instead of hot aisle.
- Tool-less design for easy replacement and repair.
- Less PSU quantities in whole rack to minimize maintenance efforts.
Higher MTBF
- Centralizing power supplies and removing unnecessary components to enhance MTBF (Mean Time Between Failures).
- Avoids system downtime caused by component failure and minimizes maintenance efforts.
Flexible Node Configuration
GIGABYTE’s OCP Open Rack Version 3 compliant solutions maintain the cost-efficient designs created in version 2, yet these new solutions provide even more power to each node. GIGABYTE TO23-BT0, a 2OU node tray, supports three nodes and up to six CPUs in a single tray. And a similar node tray, TO25-BT0, is designed for more PCIe expansion slots with each tray supporting up to four dual-slot GPUs or eight full-height full-length single slot cards for growing HPC and AI needs in data centers.
