H223-S10-AAP1

High Density Server - 5th/4th Gen Intel® Xeon® Scalable - 2U 3-Node UP 6-Bay E1.S Gen4 NVMe
  • 2U 3-node front access server system
  • Single 5th/4th Gen Intel® Xeon® Scalable Processors per node
  • Single Intel® Xeon® CPU Max Series per node
  • 8-Channel DDR5 RDIMM, 24 x DIMMs
  • Dual ROM Architecture
  • 2 x CMC ports
  • 6 x 9.5mm E1.S Gen4 NVMe hot-swappable bays
  • 3 x M.2 slots with SATA interface
  • 6 x FHHL PCIe Gen5 x16 slots
  • 3 x LP PCIe Gen5 x16 slots
  • 3 x LP PCIe Gen5 x8 slots
  • 1+1 3000W 80 PLUS Titanium redundant power supplies
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* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.

SPECIFICATIONS

Dimensions (WxHxD, mm)
2U 3-Node - Front access
447.8 x 87.5 x 500
Motherboard
MS13-HD0
CPU
5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Single processor per node

TDP up to 350W at ambient 35°C with 1 x PCIe slot occupied
TDP up to 350W at ambient 30°C with 2 x PCIe slots occupied
TDP up to 300W at ambient 35°C with 3 x PCIe slots occupied
TDP up to 300W at ambient 30°C with 4 x PCIe slots occupied

Please contact technical support for more details.
Socket
Per Node:
1 x LGA 4677

Total:
3 x LGA 4677

Socket E
Chipset
Intel® C741
Memory
Per node:
8 x DIMM slots

Total:
24 x DIMM slots

DDR5 memory supported only
8-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported

5th Gen Intel® Xeon®: Up to 5600 MT/s
4th Gen Intel® Xeon®: Up to 4800 MT/s
Intel® Xeon® Max Series: Up to 4800 MT/s
LAN
Total:
2 x CMC ports
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp

Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage
Per node:
2 x 9.5mm E1.S Gen4 NVMe hot-swappable bays

Total:
6 x 9.5mm E1.S Gen4 NVMe hot-swappable bays
SAS
N/A
RAID
N/A
Expansion Slots
Per node:
Riser Card CRSH02D:
- 2 x PCIe x16 (Gen5 x16) FHHL slots

Riser Card CRSH02E:
- 1 x PCIe x16 (Gen5 x16) low-profile slot
- 1 x PCIe x16 (Gen5 x8) low-profile slot

1 x M.2 slot (CFPH010):
- M-key
- SATA, from PCH
- Supports 2242/2260/2280/22110 cards

Total:
Riser Card CRSH02D x 3:
- 6 x PCIe x16 (Gen5 x16) FHHL slots

Riser Card CRSH02E x 3:
- 3 x PCIe x16 (Gen5 x16) low-profile slots
- 3 x PCIe x16 (Gen5 x8) low-profile slots

3 x M.2 slots (CFPH010):
- M-key
- SATA, from PCH
- Support 2242/2260/2280/22110 cards
Internal I/O
Per node:
1 x TPM header
1 x VROC connector
Front I/O
Per node:
1 x USB 3.2 Gen1 (Type-C)
1 x Mini-DP
1 x Power button with LED
1 x System status LED
1 x ID LED

Total:
3 x USB 3.2 Gen1 (Type-C)
3 x Mini-DP
3 x Power buttons with LED
3 x System status LEDs
3 x ID LEDs
2 x CMC ports
1 x CMC status LED
Rear I/O
N/A
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4
TPM
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
Power Supply
1+1 3000W 80 PLUS Titanium redundant power supplies

AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-220V~/ 15.5A, 50-60Hz
- 220-240V~/ 15.5A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 15.5A

DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 81A
+12Vsb/ 3A
- Max 2600W/ 200-220V~
+12.2V/ 213A
+12Vsb/ 3A
- Max 3000W/ 220-240V~ or 240Vdc Input
+12.2V/ 245A
+12Vsb/ 3A

Note: The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page

Additional certifications:
Windows Server 2022 (x64)
System Fans
4 x 80x80x38mm (18,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 17.2 kg
Gross Weight: 29 kg
Packaging Dimensions
857 x 670 x 280 mm
Packaging Content
1 x H223-S10-AAP1
3 x CPU heatsinks
1 x Mini-DP to D-Sub cable
9 x Carriers
1 x L-shape Rail kit
Part Numbers
- Barebone package (5th/4th Gen): 6NH223S10DR000ABP1*
- Barebone package (4th Gen): 6NH223S10DR000AAP1*
- Motherboard: 9MS13HD0UR-000
- L-shape Rail kit: 25HB2-A86105-K0R
- CPU heatsink: 25ST1-453207-C1R
- Front panel board - CFPH030: 9CFPH030NR-00
- Backplane board - CBP2060: 9CBP2060NR-00
- Fan module: 25ST2-88382V-S1R
- Riser card - CRSH02D: 9CRSH02DNR-00
- Riser card - CRSH02E: 9CRSH02ENR-00
- EDSFF riser card - CSPP010: 9CSPP010NR-00
- I/O board with M.2 slot - CFPH010: 9CFPH010NR-00
- LAN bridge board - CLSH13: 9CLSH13NR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000F-G1S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- RMA packaging: 6NH223S10SR-RMA-A100
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.

SUPPORT

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Linux
Warning:
Because BIOS flashing is potentially risky, if you do not encounter problems using the current version of BIOS, it is recommended that you not flash the BIOS. To flash the BIOS, do it with caution. Inadequate BIOS flashing may result in system malfunction.

What is a BETA?
BETA describes a new version that is reliable yet may not include all the features of the final product. During this phase we are previewing new features and gathering customer input to insure our product provides the best experience possible.

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Windows Server 2016 R2 64bit
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Windows Server 2012 64bit
  • Windows 10 64bit
  • VMware
  • Ubuntu
  • Linux CentOS
  • Linux
Utility
Description
Version
Size
Date
GSM CLI
Version : 2.1.77
147.89 MB
Sep 27, 2024
OS: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
Manual
Description
Version
Size
Date
Description
Version
Size
Date
OS Support List
Version : R12
0.22 MB
Jul 15, 2024
4th Generation Intel® Xeon® Scalable Processors
5th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series

RESOURCES

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